GlobalFoundries and TSMC Forge $2B US Silicon Interposer Deal
GlobalFoundries (GF) has announced a significant manufacturing agreement with TSMC, aiming to establish a US-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem.
This multi-year, $2 billion deal will bolster the capacity of the advanced packaging ecosystem and address the escalating demand driven by artificial intelligence (AI) and high-performance computing (HPC) technologies.
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